Electronic component mounting apparatus and electronic component mounting method

ABSTRACT

In an electronic component mounting method in which electronic components are sucked/held by plural respective nozzles provided on a mounting head so as to be mounted on electronic component mounting portions of a board, such a mounting operation is sequentially carried out as to all of the electronic components, in which the electronic components are sucked/held by the plural nozzles; an electronic component sucked/held by one of the plural nozzles is provisionally positioned above one electronic component mounting portion; both this electronic component and the electronic component mounting portion are observed by an observation head which is located between the board and the mounting head; a relative position detecting operation for detecting a relative positional relationship between this electronic component and the electronic component mounting portion is carried out as to all of the electronic components held by the mounting head; and the electronic component is positioned with respect to the electronic component mounting portion so as to be mounted thereon while the detected relative positional relationship is reflected.

BACKGROUND OF THE INVENTION

The present invention is related to an electronic component mountingapparatus and an electronic component mounting method, which mount anelectronic component on a board.

In electronic component mounting apparatus, mounting operations arerepeatedly carried out in which electronic components derived fromelectronic component supply units are held by mounting heads and thenare mounted on boards. In these mounting operations, since theelectronic components are required to be positioned on the boards inhigher precision, such positioning methods have been widely employed. Inthe positioning methods, while both the electronic components being heldby the mounting heads and positions of mounting points on the boards areoptically detected, the electronic components and the boards arerelatively positioned with each other based upon position detectingresults.

In such an optical position detecting operation, two images acquired byphotographing an electronic component and a board by a camera areprocessed by way of an image recognizing process operation so as toexecute this optical position detecting operation. In this imagerecognizing process operation, since both the electronic component andthe mounting position of the board are recognized based upon differentimages, in order that the electronic component is positioned withrespect to the mounting point of the board in higher precision, it isvery important to correctly acquire a relative positional relationshipbetween these two images with respect to an optical coordinate system.

To this end, such a camera of upper/lower visual-field directions hasbeen employed (for example, see Japanese Laid-open Patent ApplicationNo. 2001-77592). In this camera, both a board recognizing camera whosephotographing visual-field direction is downwardly directed and anelectronic component recognizing camera whose photographing visual-fielddirection is upwardly directed are constructed in an integral form. Whenthis camera is used, generally speaking, under such a condition that amounting head which holds an electronic component is positioned over aboard, this camera is advanced to a space formed between the mountinghead and the board, and then simultaneously acquires both an image as toa mounting point of the board and an image as to the electroniccomponent held by the mounting head. As a result, a relative positionalrelationship between a photographing visual field along the upperdirection and a photographing visual field along the lower direction iscontinuously maintained, so that high-precision position detectingoperations may be realized.

However, in the above-described prior art, since there is such arestriction that the camera must be positioned between the board and themounting head, a limitation is made in shortening of tact time of themounting operation. In other words, since the above-described positiondetecting operation is carried out with respect to each of theelectronic components mounted by the mounting head, in a mountingoperation of one electronic component, both an operation for advancingthe camera just under the mounting head so as to acquire images, andanother operation for evacuating the camera from the space over theboard in order to avoid interference occurred between the camera and thedescending operation of the mounting head after the images have beenacquired are required to be carried out every time the above-describedmounting operation of one electronic component is performed.

Also, when the mounting head which has held the electronic componentperforms the mounting operation over the board, an elevation height ofthe mounting head must be set to a low value as being permitted aspossible in order that the operation time thereof may be desirablyshortened. However, as previously explained, since such a clearance bywhich the camera can be advanced must be secured, the descent amount ofthe mounting head required in the mounting operation cannot bedecreased. As previously explained, in the conventional electroniccomponent mounting apparatus, the superior mounting position precisioncan be hardly compatible with the electronic component mounting workexecuted in the high efficiency.

SUMMARY OF THE INVENTION

Under such a circumstance, an object of the present invention is toprovide an electronic component mounting apparatus and an electroniccomponent mounting method, capable of realizing that superior mountingposition precision is compatible with an electronic component mountingwork executed in a high efficiency.

An electronic component mounting apparatus, according to the presentinvention, is featured by comprising: a holding unit for holding aboard; a mounting head equipped with a plurality of mounting nozzles forsucking/holding electronic components and having a mounting nozzleelevation mechanism for separately elevating the plural mountingnozzles; electronic component supplying means for supplying theelectronic components to the mounting head; a mounting head transportmechanism for transporting the mounting head between the holding unitand the electronic component supplying means; an observation head foracquiring both an image of a provisionally positioned electroniccomponent and an image of an electronic component mounting portion froma space defined between the electronic component mounting portion andthe provisionally positioned electronic component under such a conditionthat the electronic component sucked/held by the mounting nozzle hasbeen provisionally positioned above a plurality of electronic componentmounting portions formed on the board; an observation head transportmechanism for transporting the observation head in synchronism with theelectronic components which are sequentially and provisionallypositioned by moving the mounting head, and also for evacuating theobservation head from an upper space of the holding unit when theelectronic component is mounted on the board; and control means forcontrolling the mounting head transport mechanism based upon both theimage of the electronic component and the image of the electroniccomponent mounting portion, which have been acquired by the observationhead, so as to sequentially position the electronic componentssucked/held by the respective mounting nozzles with respect to theelectronic component mounting portions corresponding thereto.

An electronic component mounting apparatus, according to the presentinvention, is featured by comprising: a provisionally positioningoperation processing part for sequentially positioning the electroniccomponents sucked/held by the plurality of mounting nozzles to an upperspace of the electronic component mounting portions by controlling themounting head transport mechanism; observing means equipped with anobservation head for acquiring both an image of the provisionallypositioned electronic component and an image of the electronic componentmounting portion from a space defined between the provisionallypositioned electronic component and the electronic component mountingportion every a set of the provisionally positioned electronic componentand the electronic component mounting portion; a provisional-positioningpositional information storage part for storing thereinto a position ofthe mounting head when a provisional positioning operation is carriedout as provisional-positioning positional information every the set; arelative positional relationship calculating process part forcalculating a relative positional relationship between the electroniccomponent sucked/held by the mounting nozzle and the electroniccomponent mounting portion every the set based upon both the image ofthe electronic component and the image of the electronic componentmounting portion on which the electronic component is mounted, whichhave been acquired by the observation head; a relative positionalrelationship storage part for storing thereinto the relative positionalrelationship calculated by the relative positional relationshipcalculating process part every the set; an alignment informationcalculating part for calculating alignment information used to positionthe mounting head based upon both the provisional-positioning positionalinformation and the relative positional relationship every the set,which have been stored into the provisional-positioning positionalinformation storage part and the relative positional relationshipstorage part, respectively; and a mounting operation processing part forcontrolling the mounting head transport mechanism based upon thealignment information so as to sequentially position the electroniccomponents sucked/held by the respective mounting nozzles with respectto the corresponding electronic component mounting portions and to mountthe positioned electronic components on the corresponding electroniccomponent mounting portions.

An electronic component mounting apparatus, according to the presentinvention, is featured by comprising: a provisionally positioningoperation processing part for sequentially positioning the electroniccomponents sucked/held by the plurality of mounting nozzles to an upperspace of the electronic component mounting portions by controlling themounting head transport mechanism; observing means equipped with anobservation head for acquiring both an image of the provisionallypositioned electronic component and an image of the electronic componentmounting portion from a space defined between the provisionallypositioned electronic component and the electronic component mountingportion every a set of the provisionally positioned electronic componentand the electronic component mounting portion; a relative positionalrelationship calculating process part for calculating a relativepositional relationship between the electronic component sucked/held bythe mounting nozzle and the electronic component mounting portion everythe set based upon both the image of the electronic component and theimage of the electronic component mounting portion on which theelectronic component is mounted, which have been acquired by theobservation head; an alignment information calculating part forcalculating alignment information used to position the mounting headbased upon both a position of the mounting head when the provisionalpositioning operation is carried out and the relative positionalinformation; an alignment information storage part for storing thereintothe alignment information calculated by the alignment informationcalculating part every the set; and a mounting operation processing partfor controlling the mounting head transport mechanism based upon thealignment information so as to sequentially position the electroniccomponents sucked/held by the respective mounting nozzles with respectto the corresponding electronic component mounting portions and to mountthe positioned electronic components on the corresponding electroniccomponent mounting portions.

An electronic component mounting method, according to the presentinvention, is featured by such an electronic component mounting methodin which an electronic component is sucked/held by each of a pluralityof mounting nozzles provided in a mounting head so as to be mounted onan electronic component mounting portion of a board, comprising: acomponent holding step for sucking/holding electronic components by theplurality of mounting nozzles of the mounting head; a provisionalpositioning step for provisionally positioning the electronic componentsucked/held by one of the plural mounting nozzles above one electroniccomponent mounting portion; an observing step in which both an image ofthe provisionally positioned electronic component and an image of theelectronic component mounting portion are acquired by an observationhead located in a space defined between the provisionally positionedelectronic component and the electronic component mounting portion; arelative positional relationship detecting step for detecting a relativepositional relationship between the provisionally positioned electroniccomponent and the electronic component mounting portion based upon theimages of both the electronic component and the electronic componentmounting portion, which are acquired in the observing step; a step forsequentially executing the provisional positioning step, the observingstep, and the relative positional relationship detecting step as to allof the electronic components sucked/held by other mounting nozzles; anobservation head evacuating step for evacuating the observation headfrom an upper space of the board; and also, a step in which such amounting operation that the electronic components sucked/held by theplurality of mounting nozzles are positioned so as to be mounted on theelectronic component mounting portions by transporting the mounting headwhile reflecting thereto the relative positional relationship detectedin the relative positional relationship detecting step is carried outwith respect to all of the electronic components.

An electronic component mounting method, according to the presentinvention, is featured by comprising: a component holding step forsucking/holding electronic components by the plurality of mountingnozzles of the mounting head; a provisional positioning step forprovisionally positioning the electronic component sucked/held by one ofthe plural mounting nozzles above one electronic component mountingportion; an observing step in which one set of both an image of theprovisionally positioned electronic component and an image of theelectronic component mounting portion are acquired by an observationhead located in a space defined between the provisionally positionedelectronic component and the electronic component mounting portion; arelative positional relationship detecting step for detecting a relativepositional relationship between the provisionally positioned electroniccomponent and the electronic component mounting portion based upon theimages of both the electronic component and the electronic componentmounting portion, which are acquired in the observing step; a storagestep for storing thereinto the relative positional relationship andprovisional positioning positional information corresponding topositional information of the provisionally positioned mounting head; astep in which since the provisional positioning step, the observingstep, the relative positional relationship detecting step, and thestorage step are sequentially executed every a set of both all of theelectronic components sucked/held by other mounting nozzles and theelectronic component mounting portions on which the electroniccomponents are mounted, both the provisional positioning positionalinformation and the relative positional relationship are stored everythe set; an observation head evacuating step for evacuating theobservation head from an upper space of the board; and a step in whichalignment information is calculated every the set based upon the storedprovisional positioning positional information and the stored relativepositional information, and then, such a mounting operation is executedevery the set, in which the electronic components are positioned so asto be mounted with respect to the electronic component mounting portionsby transporting the mounting head based upon the alignment information.

An electronic component mounting method, according to the presentinvention, is featured by comprising: a component holding step forsucking/holding electronic components by the plurality of mountingnozzles of the mounting head; a provisional positioning step forprovisionally positioning the electronic component sucked/held by one ofthe plural mounting nozzles above one electronic component mountingportion; an observing step in which one set of both an image of theprovisionally positioned electronic component and an image of theelectronic component mounting portion are acquired by an observationhead located in a space defined between the provisionally positionedelectronic component and the electronic component mounting portion; arelative positional relationship detecting step for detecting a relativepositional relationship between the provisionally positioned electroniccomponent and the electronic component mounting portion based upon theimages of both the electronic component and the electronic componentmounting portion, which are acquired in the observing step; an alignmentinformation calculating step for calculating alignment information basedupon both the relative positional relationship and provisionalpositioning positional information corresponding to positionalinformation of the provisionally positioned mounting head; a storagestep for storing thereinto the calculated alignment information; a stepin which since the provisional positioning step, the observing step, therelative positional relationship detecting step, the alignmentinformation calculating step, and the storage step are sequentiallyexecuted every a set of both all of the electronic componentssucked/held by other mounting nozzles and the electronic componentmounting portions on which the electronic components are mounted,alignment information is stored every the set; an observation headevacuating step for evacuating the observation head from an upper spaceof the board; and a step in which such a mounting operation is executedevery the set, in which the electronic components are positioned so asto be mounted with respect to the electronic component mounting portionsby transporting the mounting head based upon the stored alignmentinformation.

In accordance with the present invention, in such an electroniccomponent mounting operation that the electronic components aresucked/held by the respective plurality nozzles provided on the mountinghead and are mounted on the electronic component mounting portions ofthe board 9, such a relative position detecting operation is carried outwith respect to all of the electronic components which have beensucked/held by the nozzles, while in this relative position detectingoperation, both the provisionally positioned electronic component andthe electronic component mounting portion are observed by theobservation head which is located in the space defined between thiselectronic component and the electronic component mounting portion.Then, the mounting operation for positioning the electronic componentwith respect to the electronic component mounting portion by reflectingthe calculated relative positional relationship so as to mount thispositioned electronic component thereon is sequentially carried out withrespect to all of the electronic components. As a consequence, thebetter mounting positional precision can be compatible with thehigh-efficiency component mounting work.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of an electronic component mounting apparatusaccording to an embodiment 1 of the present invention.

FIG. 2 is a side sectional view of the electronic component mountingapparatus of the embodiment 1 of the present invention.

FIG. 3 is a plan sectional view of the electronic component mountingapparatus of the embodiment 1 of the present invention.

FIG. 4 is a function explanatory diagram for explaining an observationhead of the electronic component mounting apparatus according to theembodiment 1 of the present invention.

FIGS. 5( a) and 5(b) are explanatory diagrams for explaining anobserving method for observing both an electronic component and a boardby the observation head of the electronic component mounting apparatusaccording to the embodiment 1 of the present invention.

FIG. 6 is an explanatory diagram for explaining an observing method forobserving both an electronic component and a board by the observationhead of the electronic component mounting apparatus according to theembodiment 1 of the present invention.

FIG. 7 is a perspective view of a reversing stage of the electroniccomponent mounting apparatus according to the embodiment 1 of thepresent invention.

FIGS. 8( a) and 8(b) are operation explanatory diagrams of the reversingstage of the electronic component mounting apparatus according to theembodiment 1 of the present invention.

FIG. 9 is a block diagram for indicating an arrangement of a controlsystem of the electronic component mounting apparatus according to theembodiment mode 1 of the present invention.

FIG. 10 is a functional block diagram for showing processing functionsin the case of a standard mode of the electronic component mountingapparatus according to the embodiment 1 of the present invention.

FIG. 11 is a flow chart for explaining an electronic component mountingmethod (standard mode) of the embodiment 1 of the present invention.

FIGS. 12( a) and 12(b) are step explanatory diagrams for explaining theelectronic component mounting method (standard mode) of the embodiment 1of the present invention.

FIGS. 13( a) and 13(b) are step explanatory diagrams for explaining theelectronic component mounting method (standard mode) of the embodiment 1of the present invention.

FIGS. 14( a) and 14(b) are step explanatory diagrams for explaining theelectronic component mounting method (standard mode) of the embodiment 1of the present invention.

FIGS. 15( a) and 15(b) are step explanatory diagrams for explaining theelectronic component mounting method (standard mode) of the embodiment 1of the present invention.

FIG. 16 is a functional block diagram for indicating processingfunctions in the case that the electronic component mounting apparatusaccording to the embodiment 1 of the present invention is operated in ahigh precision mode.

FIG. 17 is a flow chart for explaining an electronic component mountingmethod (high precision mode) of the embodiment 1 of the presentinvention.

FIGS. 18( a) and 18(b) are step explanatory diagrams for explaining theelectronic component mounting method (high precision mode) of theembodiment 1 of the present invention.

FIGS. 19( a) and 19(b) are step explanatory diagrams for explaining theelectronic component mounting method (high precision mode) of theembodiment 1 of the present invention.

FIGS. 20( a) and 20(b) are step explanatory diagrams for explaining theelectronic component mounting method (high precision mode) of theembodiment 1 of the present invention.

FIGS. 21( a) and 21(b) are step explanatory diagrams for explaining theelectronic component mounting method (high precision mode) of theembodiment 1 of the present invention.

FIGS. 22( a) and 22(b) are step explanatory diagrams for explaining theelectronic component mounting method (high precision mode) of theembodiment 1 of the present invention.

FIG. 23 is a functional block diagram for indicating processingfunctions in the case that the electronic component mounting apparatusaccording to the embodiment 1 of the present invention is operated in ahigh speed mode.

FIG. 24 is a flow chart for explaining an electronic component mountingmethod (high speed mode) of the embodiment 1 of the present invention.

FIG. 25 is a functional block diagram for indicating processingfunctions in the case that the electronic component mounting apparatusaccording to the embodiment 2 of the present invention is operated in astandard mode.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

(Embodiment 1)

In the patent specification of the present invention, it is soconsidered that a carrier member (carrier jig) to which a plurality ofpiece boards have been set is also a “board”. In this case, it is soassumed that a mounting unit of an electronic component, which has beenformed on a piece board set to the carrier member corresponds to“electronic component mounting portion which has been formed on board”.

First, an entire structure of an electronic component mounting apparatuswill now be explained with reference to FIG. 1, FIG. 2, and FIG. 3. FIG.2 is a sectional view for showing the electronic component mountingapparatus, taken along an arrow “A—A” of FIG. 1. FIG. 3 is anothersectional view for indicating the electronic component mountingapparatus, taken along an arrow “B—B” of FIG. 2. In FIG. 1, anelectronic component supplying unit 2 is arranged on a base 1. As shownin FIG. 2 and FIG. 3, the electronic component supplying unit 2 isequipped with a jig holder 3, and this jig holder 3 detachably holdsthereon a jig 4 on which an adhesive seat 5 has been mounted.

Semiconductor chips 6 (will be simply abbreviated as “chips 6”hereinafter) corresponding to an electronic component are adhered on theadhesive seat 5 under such a condition that these semiconductor chipsare individually separated. A plurality of bumps 6 a (see FIG. 8( a))corresponding to projected electrodes are formed on an upper plane ofthe chips 6. Under such a condition that the jig 4 is held by the jigholder 3, the electronic component supplying unit 2 supplies a pluralityof chips 6 under such a condition that bump formed planes thereof aredirected to an upper direction.

As indicated in FIG. 2, an ejector 8 is arranged under the adhesive seat5 held by the jig holder 3 in such a manner that the ejector 8 can bemoved along a horizontal direction by an ejector XY table 7. The ejector8 is equipped with a pin elevation mechanism which elevates a raisingejector pin (not shown). When the chip 6 is picked up from the adhesiveseat 5 by a mounting head (will be discussed later), the chip 6 israised by the ejector pin 6 from a lower direction of the adhesive seat5, so that the chip 6 exfoliates from the adhesive seat 5. The ejector 8constitutes an adhesive seat exfoliation mechanism for exfoliating thechip 6 from the adhesive seat 5.

As shown in FIG. 3, a holding unit 10 is arranged at a positionseparated from the electronic component supply unit 2 on the upper planeof the base 1 along a Y direction (namely, first direction). Boardcarry-in conveyers 11 and 12 are arrayed in a series manner on the upperstream side of the holding unit 10 along an X direction (namely, seconddirection), whereas board carry-out conveyers 13 and 14 are arrayed in aseries manner on the lower stream side of the holding unit 10 along theX direction. The board carry-in conveyers 11 and 12 receive the board 9supplied from the upper stream side, and then pass the received board 9to the holding unit 10. The holding unit 10 holds thereon the passedboard 9 and positions this board 9 at a packaging position. The mountedboard 9 is carried out to the down stream side.

In this case, the holding unit 10 may be freely elevated only over apredetermined elevation stroke by a holding unit elevation mechanism 16(see FIG. 2). A height of the board 9 under such a condition that theholding unit 10 has been ascended (see FIG. 2 and FIG. 13) becomes equalto a component mounting height in the case that the chip 6 is mounted onthe board 9 by a mounting head 33 (will be explained later) A height ofthe board 9 under such a condition that the holding unit 10 has beendescended (see FIG. 12 and FIG. 13) becomes equal to an observationheight in the case that both the chip 6 and the electronic componentmounting portion 9 a are observed by an observation head 34 (will bediscussed later).

In FIG. 1, on both edge portions of the upper plane of the base 1, botha first Y-axis base 20A and a second Y-axis base 20B are arranged insuch a manner that longitudinal directions of the first Y-axis base 20Aand the second Y-axis base 20B are directed to the Y direction which isintersected to the board convey direction (X direction). Y-directionalguides 21 are arranged over a substantially entire length thereof alonga longitudinal direction (Y direction) on upper planes of the firstY-axis base 20A and the second Y-axis base 20B. A pair of theY-directional guides 21 are arranged in such a mode that the pairedY-directional guides 21 are located in parallel to each other andsandwich both the electronic component supply unit 2 and the holdingunit 10.

Three beams are slidably installed on these paired Y-directional guides21 along the Y direction in such a manner that both edge portions ofeach of the three beams (namely, first beam member 31, center beammember 30, and second beam member 32) are supported by the Y-directionalguides 21.

While a nut member 23 b is projectedly provided on a right-sided sideedge portion of the center beam member 30, a feed screw 23 a which ismeshed with this nut member 23 b is rotated by a Y-axis motor 22 whichis arranged on the first Y-axis base 20A along the horizontal direction.Since the Y-axis motor 22 is driven, the center beam member 30 ishorizontally moved in the Y direction along the Y-directional guides 21.

Also, a nut member 25 b and another nut member 27 b are projectedlyprovided on left-sided side edge portions of the first beam member 31and the second beam member 32, respectively. A feed screw 25 a andanother feed screw 27 a, which are meshed with the nut members 25 b and27 b, are rotated by a Y-axis motor 24 and another Y-axis motor 26,which are arranged on the second Y-axis base 20B along the horizontaldirection, respectively. Since the Y-axis motors 24 and 26 are driven,both the first beam member 31 and the second beam member 32 arehorizontally moved in the Y direction along the Y-directional guides 21.

While the mounting head 33 is mounted on the center beam member 30, afeed screw 41 a which is meshed with the nut member 41 b coupled to themounting head 33 is rotated by an X-axis motor 40. The mounting head 33is guided by X-directional guides 42 (see FIG. 2) along the X direction,and the X-directional guides 42 are provided on the side plane of thecenter beam member 30 along the X direction.

The mounting head 33 is equipped with a plurality (four pieces in thiscase) of nozzles (mounting nozzles) 33 a which each suck and hold onepiece of the chip 6. The mounting head 33 maybe moved under such acondition that while the respective chips 6 are sucked/held by therespective nozzles 33 a, this mounting head 33 holds the plural chips 6.Then, the mounting head 33 owns a mounting nozzle elevation mechanismwhich separately elevates these nozzles 33 a, and can mount the chips 6by picking up separately these chips 6 by the respective nozzles 33 a.

Since both the Y-axis motor 22 and the X-axis motor 40 are driven, themounting head 33 is horizontally moved along both the X direction andthe Y direction. The chips 6 of the electronic component supplying unit2 are sucked/held by the plural nozzles 33 a, and the mounting head 33mounts these chips 6 on a plurality of electronic component mountingportions 9 a (see FIG. 5) formed on the board 9 which is held by theholding unit 10.

One pair of Y-directional guides 21, the center beam member 30, aY-directional drive mechanism (namely, Y-axis motor 22, feed screw 23 a,and nut member 23 b) and an X-directional drive mechanism (namely,X-axis motor 40, feed screw 41 a, and nut member 41 b) constitute amounting head transport mechanism 59 (see FIG. 10) which transports themounting head 33 between the electronic component supplying portion 2and the holding unit 10. The Y-directional drive mechanism transportsthe center beam member 30 along the Y-directional guides 21. TheX-directional drive mechanism transports the mounting head 33 along theX-directional guides 42.

An observation head 43 equipped with a lens-barrel portion 34 a which iselongated along the horizontal direction is mounted on the first beammember 31, and a nut member 44 b is coupled to a bracket 34 b whichholds the observation head 34. A feed screw 44 a which is meshed withthe nut member 44 b is rotated by the X-axis motor 43, and since theX-axis motor 43 is driven, the observation head 34 is guided by anX-directional guide 45 (see FIG. 2) which is provided on the side planeof the first beam member 31 so as to be transported along the Xdirection.

As indicated in FIG. 3, both a provisional positioning camera 15 and areversing stage 17 are arranged between the electronic componentsupplying portion 2 and the holding unit 10. While the provisionalpositioning camera 15 is equipped with a line camera, since the mountinghead 33 in which the chip 6 is held by the nozzle 33 a is transportedabove the provisional positioning camera 15, the provisional positioningcamera 15 acquires an image of the chip 6 held by the nozzle 33 a. Then,this acquired image is recognizing-processed by an electronic componentprovisional recognizing unit 57 (FIG. 10, will be explained later), sothat a position of the chip 6 is recognized. As will be explained later,this positional recognition corresponds to a provisional recognition forprovisionally positioning the chip 6 to the electronic componentmounting portion 9 a on the board 9.

Now, a function of the observation head 34 will be explained withreference to FIG. 4. As indicated in FIG. 4, the observation head 34 isconstituted by that both an electronic component-imaging camera 36Awhich observes the chip 6 and a board-imaging camera 36B which observesthe electronic component mounting portion 9 a of the board 9 arecombined via a lens 37A and another lens 37B with the lens-barrelportion 34 a.

An illuminating unit 39A and another illuminating unit 39B areprovided-on both an upper plane and a lower plane of the lens-barrelportion 34 a. These illuminating units 39A and 39B illuminateilluminating light with respect to the chip 6 and the board 9, whichcorrespond to observation objects.

A mirror 38A and another mirror 38B are arranged at positions forconducting incident light to the lenses 37A and 37B within thelens-barrel portion 34 a, and furthermore, a prism 38C are built in thislens-barrel portion 34 a. This prism 38C reflects the incident lightentered from both the upper and lower directions to any one of themirrors 38A and 38B.

Since the lens-barrel portion 34 a is advanced to a space definedbetween the two observation objects which are positioned along both theupper/lower directions and then the prism 38C is positioned to theobservation objects, both an optical path “A” and another optical path“B” are formed at the same time. The optical path “A” is defined fromthe upper observation object via the prism 38C, the mirror 38A, and thelens 37A to the camera 36A, whereas the optical path “B” is defined fromthe lower observation object via the prism 38C, the mirror 38B, and thelens 37B to the camera 36B.

In other words, the observation camera 34 is arranged in such a mannerthat while the respective optical path “A” and optical path “B” of theelectronic component-imaging camera 36A and the board-imaging camera 36Bare horizontally provided, the prism 38C is contained which causes theoptical path “A” of the electronic component-imaging camera 36A to bedirected to an upper direction, and also, causes the optical path “B” ofthe board-imaging camera 36B to be directed to the lower direction atthe same position. In this case, both the optical path “A” directed tothe upper direction and the optical path “B” directed to the lowerdirection are located on the same vertical line by adjusting the opticalsystem.

As a consequence, as indicated in FIG. 4, the mirror-barrel portion 34 ais advanced to such a space defined between the board 9 held by theholding unit 10 and the nozzle 33 a which is positioned above this board9 by sucking/holding the chip 6, and also, the prism 38C is positionedto both the chip 6 and the electronic component mounting portion 9 a ofthe board 9, so that both an image of the chip 6 and an image of theelectronic component mounting portion 9 a of the board 9 are acquired atthe same time by the electronic component-imaging camera 36A and theboard-imaging camera 36B respectively, and thus, the relative positionalrelationship between the chip 6 and the electronic component mountingportion 9 a can be obtained.

In other words, under such a condition that the chip 6 sucked/held bythe mounting head 33 has been positionally positioned above theelectronic component mounting portion 9 a, the observation head 34acquires both the image of this chip 6 and the image of the electroniccomponent mounting portion 9 a from the provisionally-positioned chip 6and the electronic component mounting portion 9 a.

Since both the Y-axis motor 24 and the X-axis motor 43 are driven, theobservation head 34 is horizontally transported along the X directionand the Y direction. As a result, the observation head 34 may be movedabove the holding unit 10 so as to photograph the board 9 held by theholding unit 10, and also may be moved so as to be evacuated from theupper space of the holding unit 10.

One pair of the Y-directional guides 21, the first beam member 31, aY-directional drive mechanism (namely, Y-axis motor 24, feed screw 25 a,and nut member 25 b) and an X-directional drive mechanism (namely,X-axis motor 43, feed screw 44 a, and nut member 44 b) constitute anobservation head transport mechanism 58 (see FIG. 10) which transportsthe observation head 34. The Y-directional drive mechanism transportsthe first beam member 31 along the Y-directional guides 21. TheX-directional drive mechanism transports the observation head 34 alongthe X-directional guides 45.

In the electronic component mounting operation, as will be described indetail, the observation head transport mechanism 58 transports theobservation head 34 in synchronism with the chips 6 which aresequentially and provisionally positioned by transporting the mountinghead 33, and also, evacuates the observation head 34 from the upperspace of the holding unit 10 when the chips 6 are mounted on the board9. The space of a lateral direction (Y direction) of the holding unit 10constitutes an evacuating position where the observation head 34 isevacuated from the upper space of the holding unit 10.

As previously explained, the holding unit 10 may be elevated by theholding unit elevation mechanism 16. The holding unit elevationmechanism 16 may change an interval between the holding unit 10 and themounting head 33 in response to operation to be executed. In otherwords, in such a case that the observation head 34 is advanced to thespace defined between the mounting head 33 and the board 9 in order toperform the observation operation, the holding unit elevation mechanism16 extends the interval defined between the holding unit 10 and themounting head 33, and after the observation operation is accomplished,this holding unit elevation mechanism 16 narrows this interval. As aconsequence, the holding unit elevation mechanism 16 may function as aninterval changing means for changing the interval defined between themounting head 33 and the holding unit 10 after the observation head 34has been evacuated from the space defined between the own observationhead 34 and the mounting head 33.

A wafer-imaging camera 35 is mounted on the second beam member 32, and anut member 47 b is coupled to a bracket 35 a which holds thewafer-imaging camera 35. A feed screw 47 a which is meshed with the nutmember 47 b is rotated by an X-axis motor 46. Since this X-axis motor 46is driven, the wafer-imaging camera 35 is guided by X-directional guides48 (see FIG. 2) which are provided on the side plane of the second beammember 32 so as to be transported along the X direction.

Since both the Y-axis motor 26 and the X-axis motor 46 are driven, thewafer-imaging camera 35 is horizontally transported along the Xdirection and the Y direction. As a consequence, the wafer-imagingcamera 35 can be transported above the electronic component supplyingunit 2 so as to photograph the chip 6 held by the electronic componentsupplying unit 2, and can be transported so as to be evacuated from theupper space of the electronic component supplying unit 2.

One pair of the Y-directional guides 21, the second beam member 32, aY-directional drive mechanism (namely, Y-axis motor 26, feed screw 27 a,and nut member 27 b), and an X-directional drive mechanism (namely,X-axis motor 46, feed screw 47 a, and nut member 47 b) constitute awafer-imaging camera transport mechanism for transporting thewafer-imaging camera 35. The Y-directional drive mechanism transportsthe second beam member 32 along the Y-axis guide 21. The X-directionaldrive mechanisms transports the wafer-imaging camera 35 along theX-directional guides 48.

Referring now to FIG. 5 and FIG. 6, a description is made of a methodfor recognizing both the board 9 and the chip 6 by the observation head31. FIG. 5 indicates a two-point recognizing method in which since 2points contained in an object to be recognized are recognized, aposition of an entire portion of the object to be recognized isrecognized. In the case that this 2-point recognizing method isemployed, optical magnification of the optical system is increased whichis employed so as to perform photographing operations by the electroniccomponent-imaging camera 36A and the board-imaging camera 36B, and aphotographing visual field is set to a narrow visual field “W1”.

In FIG. 5( a), the board 9 is mounted on the holding unit 10, and thechips 6 have already been mounted on two sets of the electroniccomponent mounting portions 9 a among a plurality of these electroniccomponent units 9 a formed on the board 9. The mounting head 33 in whichthe chips 6 have been held by the nozzles 33 a is positioned above theholding unit 10. At this time, the mounting head 33 is brought into sucha condition that this mounting head 33 has been provisionally positionedsubstantially just above the electronic component mounting portion 9 acorresponding to the chip 6 held by the nozzle 33 a.

Under this provisionally positioning condition, the observation head 34is entered into the space defined between the board 9 and the chip 6 soas to perform photographing operations for simultaneously recognizingboth the chip 6 and the board 9. At this time, the observation head 34is firstly moved in such a manner that the visual fields “W1” of theelectronic component-imaging camera 36A and the board-imaging camera 36Bmay cover both the bump 6 a located at a diagonal position of one sideof the chip 6, and the electrode 9 b located at a diagonal position ofone side of the electronic component mounting portion 9 a, respectively.Then, both images located within the respective visual fields “W1” areacquired by the electronic component-imaging camera 36A and theboard-imaging camera 36B.

Next, as shown in FIG. 5( b), the observation head 34 is moved, and thenthis observation head 34 is transported in such a manner that the visualfields “W1” of the electronic component-imaging camera 36A and theboard-imaging camera 36B may cover both the bump 6 a located at adiagonal position of the other side of the chip 6, and the electrode 9 blocated at a diagonal position of the other side of the electroniccomponent mounting portion 9 a, respectively. Then, both images locatedwithin the respective visual fields “W1” are acquired by the electroniccomponent-imaging camera 36A and the board-imaging camera 36B in asimilar manner.

Then, since the image data which have been acquired by theabove-described two photographing operations by the observation head 34are processed by the recognizing operation, both the position of thechip 6 and the position of the electronic component mounting portion 9 aon the board 9 may be recognized, while this chip 6 is held by themounting head 33. This two-point recognizing method is employed in sucha case that a size of a chip 6 to be checked is excessively large andthe entire portion of this chip 6 cannot be stored within the samevisual field, and also, high positional recognition precision isrequired.

In the case that this 2-point recognizing method, since a target pointis required to be firmly located within the narrow visual field “W1”, aswill be explained later, such a provisional recognizing operation iscarried out by which the chip 6 set under the condition that this chip 6is being held by the mounting head 33 is recognized by the provisionalpositioning camera 15, and then, the mounting head 33 is provisionallypositioned based upon this provisional recognition result.

FIG. 6 indicates a batch recognizing method capable of recognizing anentire portion as to the chip 6 and the electronic component mountingportion 9 a in a batch manner by executing a single photographingoperation. In this case, while photographing visual fields of both theelectronic component-imaging camera 36A and the board-imaging camera 36Bhave been set to wide visual fields “W2”, the observation head 34 isadvanced to the space defined between the chip 6 and the board 9. Then,under this condition, both an entire image of the chip 6 and an entireimage of the electronic component mounting portion 9 a within therespective visual fields “W2” are acquired by the electroniccomponent-imaging camera 36A and the board-imaging camera 36B. It shouldbe understood that when the batch recognizing method is carried out,since any one of the chip 6 and the electronic component mountingportion 9 a may be easily involved by the wide visual fields “W2”, theprovisional recognizing operation of the chip 6 by using the provisionalpositioning camera 15 is not always required.

Next, the reversing stage 17 corresponding to the up-down reversingmeans will now be explained with reference to FIG. 7 and FIG. 8. In FIG.7, two supporting posts 72 coupled to a block 71 are projectedlyprovided on a horizontal base member 70. A reversing table 73 isrotatably held by the supporting posts 72 around a horizontal shaft 73a, and an reversing actuator 75 is coupled to this horizontal shaft 73a. Since the reversing actuator 75 is driven, the shaft 73 a is rotatedby 180 degrees, so that the reversing table 73 performs up-downreversing operation.

While a holding head 74 is provided on the reversing table 73, aplurality of chip holding units 74 a are arrayed on the holding head 74.While the chip holding units 74 a are equipped with absorption holes 74b, the chip holding units 74 a suck and hold the chips 6 through theabsorption holes 74 b in a vacuum sucking manner under such a conditionthat the chips 6 whose bump-formed planes are directed to the upperdirection have been mounted on the respective chip holding units 74 a.In other words, the chip holding units 74 a hold the rear planes of thechips 6 set to such a condition that the bump-formed planes thereof aredirected to the upper direction (see FIG. 8( a)).

In this case, since the receiving/supplying operations of the chips 6 tothe holding head 74 are carried out in such a manner that the chips 6are picked up from the electronic component supplying unit 2 by thenozzles 33 a of the mounting head 33 and then the picked chips 6 aretransported to the holding head 74 where the chip holding units 74 a aredirected to the upper direction, it is so set that the array of the chipholding units 74 a in the holding head 74 is made coincident with thearray of the nozzles 33 a of the mounting head 33.

Two slide posts 76 are projectedly provided on the base member 70, andsliders 77 are coupled to an elevation table 78. These sliders 77 areslidably engaged with the slide posts 76 along upper/lower directions. Arod 84 a of an elevating actuator 84 is coupled to the elevation table78. Since the elevating actuator 84 is driven, the elevation table 78 iselevated along the slide posts 76.

A stage 79 is provided on an upper plane of the elevation table 78. Thestage 79 corresponds to a flat bottom vessel having a flat bottom plane79 a. This stage 79 may have a function as a transfer stage and anotherfunction as a flatting stage. The transfer stage transfers/coats a flux80 which has been supplied to the bottom plane to the bump 6 a of thechip 6. When this transfer operation is carried out, the flatting stagedepresses the bump 6 a so that a tip portion of the bump 6 a is flatted.Furthermore, this stage 79 owns such a function as an arranging stagefor arranging the chips 6 to which the fluxes 80 have beentransferred/coated in a predetermined array in order to perform thederiving operation by the mounting head 33 for deriving these chips 6.

A slide cylinder 81 is horizontally arranged on the side plane of theelevation table 78, and this slide cylinder 81 reciprocates the slideblock 82 along the horizontal direction. A squeeze unit 83 equipped withtwo squeezes which can be freely elevated is mounted on the slide block82 in such a manner that this squeeze unit 83 is elongated upwardly withrespect to the stage 79. Since the squeeze unit 83 is horizontally movedso as to execute a flux scraping-up operation and a flux extendingoperation, a flux film having a preselected thickness, the fluid planeof which has been flatted, is formed on the bottom plane of the stage79.

FIG. 8( a) indicates such a condition that after the flux film has beenformed, the elevating actuator 84 is driven so as to cause the elevationtable 78 to descend. As a result, the stage 79 descends up to a transferheight position so as to transfer/coat the flux 80. Then, under thiscondition, as shown in FIG. 8( b), the reversing actuator 75 is drivenso as to reverse the reversing table 73 with respect to the stage 79.Next, when a weight for upwardly depressing the stage 79 is exerted bythe elevating actuator 84, the lower planes of the bumps 6 a aredepressed against the stage 79 so as to flatting the bumps 6 a, andalso, the flux is transferred/coated to the bumps 6 a.

When the arranging operation of the chips 6 by the stage 79 to the flux80 has been accomplished, the elevating actuator 84 is driven so as tocause the elevation table 78 to ascend, and to position the stage 79 atthe receiving/supplying height. Under this condition, the chips 6arranged on the stage 79 are again held by the nozzles 33 a of themounting head 33, and then are mounted on the board 9 held by theholding unit 10. As a consequence, the electronic component supplyingunit 2, the reversing stage 17, and also, the mounting head 33 whichpicks up the chips 6 from the electronic component supplying unit 2 totransport the picked chips to the reversing stage 17 constitute anelectronic component supplying means. This electronic componentsupplying means supplies such chips brought into the conditions underwhich the flux 80 has been transferred/coated and the flatting operationhas been accomplished with respect to the mounting head 33 for mountingthe electronic components to the board. Also, both the reversing stage17 and the mounting head 33 for picking up the chips 6 from theelectronic component supplying unit 2 to transport the picked chips 6 tothis reversing stage 17 constitute an electronic componentreversing/supplying means. Under such a condition that the chips 6 arederived from the electronic component supplying unit 2 and are reversedalong upper/lower directions, this electronic componentreversing/supplying means supplies the reversed chips to the mountinghead 33 for mounting the chips 6 onto the board. It should also be notedthat in this embodiment, (1) the function as the electronic componenttransporting mechanism and (2) the function as the mounting mechanismare realized by the single mounting head 33. The electronic componenttransporting mechanism picks up the chips 6 from the electroniccomponent supplying unit 2 and then transports the picked chips 6 to thereverse stage 17. In the mounting function, the chips 6 which have beenreversed from the reversing stage 17 are picked up and then the pickedchips are mounted on the board. Alternatively, the electronic componenttransporting mechanism for picking up the chips 6 from the electroniccomponent supplying unit 2 and for transporting the picked chips 6 tothe reverse stage 17 may be separately provided with respect to themounting head 33.

Then, in such a step that the mounting head 33 is moved to the board 9,the mounting head 33 which has held the chips 6 is moved along the Xdirection above the provisional positioning camera 15, so that aspreviously explained, the provisional positioning camera 15 photographsthe chips 6 held by the mounting head 33.

Referring now to FIG. 9, an arrangement of a control system employed inthe electronic component mounting apparatus will be subsequentlyexplained. In FIG. 9, a mechanism driving unit 50 is arranged by a motordriver which electrically drives motors of the above-describedrespective mechanisms, a control appliance which controls air pressuresupplied to air cylinders of the respective mechanisms, and the like.Since the mechanism driving unit 50 is controlled by a control unit 53,the below-mentioned respective drive elements may be driven.

Both the X-axis motor 40 and the Y-axis motor 22 drive the mounting headtransport mechanism for transporting the mounting head 33. The X-axismotor 43 and the Y-axis motor 24 drive the observation head transportmechanism 58 for transporting the observation head 34, whereas theX-axis motor 46 and the Y-axis motor 26 drive the wafer-imaging cameratransport mechanism for transporting the wafer-imaging camera 35.

Also, the mechanism driving unit 50 drives the mounting nozzle elevationmechanism of the mounting head 33, and the component absorptionmechanism by the nozzles 33 a (see FIG. 2), and also, drives thereversing actuator 75 of the reversing stage 17, the elevating actuator84, the drive motor of the ejector 8, and the drive motor of the ejectorXY table 7. Furthermore, the mechanism driving unit 50 drives the boardcarry-in conveyers 11 and 12, the board carry-out conveyers 13 and 14,the board hold mechanism of the holding unit 10, and the holding unitelevation mechanism 16 for elevating the holding unit 10.

An electronic component recognizing unit 54 performs a recognizingprocess operation as to an image photographed by the electroniccomponent-imaging camera 36A of the observation head 34 so as torecognize a position of a chip 6 which has been sucked/held by thenozzle 33 a of the mounting head 33. A board recognizing unit 55executes a recognizing process operation as to an image photographed bythe board-imaging camera 36B of the observation head 34 so as torecognize a position of the electronic component mounting portion 9 a ofthe board 9 held by the holding unit 10. In the board 9, the electrodes9 b to which the bumps 6 a of the chips 6 are jointed are handled in thechip unit, and the electronic component mounting portion 9 a can detectthe positions by way of the image recognizing process operation.

A wafer recognizing unit 56 processes an image photographed by thewafer-imaging camera 35 in order to acquire a position of a chip 6 ofthe electronic component supplying unit 2. An electronic componentprovisional recognizing unit 57 performs a recognizing process operationas to an image photographed by the provisional positioning camera 15 soas to acquire a position of a chip 6 held by the mounting head 33. Thisposition recognition is employed in the case that the mounting head 33is provisionally positioned on the board 9, as previously described.

The recognition results acquired by the electronic component recognizingunit 54, the board recognizing unit 55, the wafer recognizing unit 56,and the electronic component provisionally recognizing unit 57 are fedto the control unit 53. An operation unit 51 corresponds to an inputapparatus such as a keyboard and a mouse. This operation unit 51 inputsdata, inputs a control command, and sets an operation mode (will bediscussed later). A display unit 52 displays thereon images which arephotographed by the observation head 34, the wafer-imaging camera 35,and the provisional positioning camera 15, and also displays thereon aguide screen when the operation unit 51 performs the input operation.

While this electronic component mounting apparatus is arranged asexplained above, both operation modes of the electronic componentmounting apparatus and electronic component mounting operations in therespective operation modes will be explained as follows: That is, in theelectronic component mounting apparatus according to this embodiment,three operation modes constructed of a high precision mode, a standardmode, and a high speed mode may be selected in response to requiredmounting precision. Switching of these operation modes may be set byoperating the operation unit 51.

Next, referring now to FIG. 10 to FIG. 15, a description is made of botha processing function and an electronic component mounting operation ofthe electronic component mounting apparatus executed in the standardmode. The electronic component mounting operation by the standard modecontains: a step in which chips (electronic components) 6 aresucked/held by a plurality of nozzles (mounting nozzles) 33 a of themounting head 33; a provisional positioning step in which a chip 6 whichhas been sucked/held by one nozzle among the plural nozzles 33 a isprovisionally positioned above one electronic component mounting portion9 a; an observing step in which both an image of the provisionallypositioned chip 6 and an image of the electronic component mountingportion 9 a are acquired by the observation head 34 located in a spacedefined between this provisionally positioned chip 6 and the electroniccomponent mounting portion 9 a; a relative positional relationshipdetecting step in which a relative positional relationship between thechip 6 and the electronic component mounting portion 9 a is detectedbased upon both the image of the chip 6 and the image of the electroniccomponent mounting portion 9 a, which have been acquired in theobserving step; a provisional positioning step for provisionallypositioning all of the chips which have been sucked/held by othernozzles 33 a; an observing step; a step for performing the relativepositional relationship detecting step; an observing head evacuatingstep for evacuating the observation head 34 from the upper space of theboard 9; and such a step in which such an operation for positioning thechips sucked/held by the plural nozzles 33 a with respect to theelectronic component mounting portions 9 a by reflecting the relativepositional relationship acquired in the relative positional relationshipdetecting step so as to transport the mounting head 33 is sequentiallycarried out with respect to all of the chips sucked/held by the nozzles33 a.

In FIG. 10, a rectangular frame 53 indicates a processing function ofthe control unit 53 in the standard mode. As will be explained later,the control unit 53 owns a function as a control means. That is, thiscontrol means controls the mounting head transport mechanism 59 basedupon the image of the chip 6 and the image of the electronic componentmounting portion 9 a acquired by the observation head 34, andsequentially positions the chips 6 sucked/held by the respective nozzles33 a to the electronic component mounting portions 9 a correspondingthereto.

A detailed function of the control unit 53 is explained. While thecontrol unit 53 contains a storage function, this control unit 53 isprovided with three storage parts, namely, a board information storagepart 53 e, a provisional-positioning positional information storage part53 f, and a relative positional relationship storage part 53 g. Theboard information storage part 53 e stores thereinto such information asto the board 9 on which the chips are mounted, namely, a board size,array information (longitudinal/lateral pitch and pitch number) of theelectronic component mounting portions 9 a (see FIG. 5 and FIG. 6) onwhich the chips 6 are mounted with respect to the board 9, and positionsof recognition marks formed on the board 9.

The provisional-positioning positional information storage part 53 fstores thereinto such a positional information which indicates a stopposition of the mounting head 33 when the chip 6 sucked/held by thenozzle 33 a of the mounting head 33 is provisionally positioned abovethe electronic component mounting portion 9 a of the board 9. In otherwords, mounting head positional information (p) outputted from themounting head transport mechanism 59 is stored as theprovisional-positioning positional information every set of the chip 6and the electronic component mounting portion 9 a in theprovisional-positioning positional information storage part 53 f. Therelative positional relationships between the chips 6 and the electroniccomponent mounting portions 9 a, which are acquired by a relativepositional relationship calculating process part 53 i (will be explainedlater) every a set of the chip 6 and the electronic component mountingportion 9 a.

This relative positional relationship indicates such a relativepositional relationship between such a chip 6 and the electroniccomponent mounting portion 9 a corresponding to this chip 6 under such acondition that the mounting head 33 in which this chip 6 is held by thenozzle 33 a is provisionally positioned with respect to the board 9. Inother words, this relative positional relationship represents apositional shift of the chip 6 along the horizontal direction withrespect to the electronic component mounting portion 9 a. This relativepositional relationship is acquired by photographing both the chip 6 andthe board 9 by the observation head 34.

Since an image data obtained by photographing a chip 6 by the electroniccomponent-imaging camera 36A is recognized/processed by the electroniccomponent recognizing unit 54, positional information of this chip 6 maybe acquired. Also, since image data obtained by photographing the board9 by the board-imaging camera 36B is recognized/processed by the boardrecognizing unit 55, positional information of the electronic componentmounting portion 9 a may be acquired. Then, based upon both thepositional information of the chip 6 and the positional information ofthe electronic component mounting portion 9 a, a relative positionalrelationship between the chip 6 and the electronic component mountingportion 9 a may be calculated by the relative positional relationshipcalculating process part 53 i.

In other words, the relative positional relationship calculating processpart 53 i acquires relative positional relationships between the chips 6sucked/held by the mounting head 33 and the electronic componentmounting portions 9 a based upon both the images of the chips 6 and theimages of the electronic component mounting portions 9 a, which havebeen acquired by the observation head 34 every a set of the chip 6 andthe electronic component mounting portion 9 a.

An alignment information calculating part 53 h calculates alignmentinformation used to position the mounting head 33 based upon both theprovisional positioning position and the relative positionalrelationship, which are stored in the provisional-positioning positionalinformation storage part 53 f and the relative positional relationshipstorage part 53 g respectively every the set of the chip 6 and theelectronic component mounting portion 9 a. This alignment informationindicates a final target position of the mounting head 33 in themounting operation for mounting the chip 6 on the electronic componentmounting portion 9 a of the board 9. This alignment information isoutputted in such a form at which contains a correction amount used tocorrect a relative positional shift between the above-described chip 6and the electronic component mounting portion 9 a.

An observation head transport processing part 53 a controls both theholding unit elevation mechanism 16 and the observation head transportmechanism 58 based upon the array information of the electroniccomponent mounting portions 9 a, which is contained in the boardinformation stored in the board information storage part 53 e so as toexecute a positioning operation of the observation head 34 when theboard 9 held by the holding unit 10 is photographed, and also, anevacuating operation for transporting the observation head 34 to such aposition which does not disturb the mounting operation of the chip 6 bythe mounting head 33.

The observation head 34, the observation head transport mechanism 58,and the observation head transporting process part 53 a constitute anobservation means equipped with the observation head 34, which acquiresboth the image of the provisionally-positioned chip 6 and the image ofthe electronic component mounting portion 9 a from the space definedbetween this chip 6 and the electronic component mounting portion 9 aevery a set of the chip 6 and the electronic component mounting portion9 a.

A pick-up operation processing part 53 b controls the mounting headtransport mechanism 59 so as to execute a positioning operation of themounting head 33 when a chip 6 is picked up from the electroniccomponent supplying unit 2 based upon the position of this chip 6 in theelectronic component supplying unit 2. The position of this chip 6 maybe acquired by recognizing/processing a photographed image by thewafer-imaging camera 35 by a wafer recognizing unit 56.

A provisional-positioning operation processing part 53 c controls themounting head transport mechanism 59 so as to sequentially position thechips 6 sucked/held by the plural nozzles 33 a above the electroniccomponent mounting portion 9 a. This provisional positioning operationis carried out based upon both the array information of the electroniccomponent mounting portion 9 a stored in the board information storagepart 53 e and the position of the chip 6 under holding condition by themounting head 33. A position of the chip 6 may be acquired by that thechip 6 held by the mounting head 33 is photographed by the provisionalpositioning camera 15, and then, this photographed result isrecognized/processed by an electronic component provisionallyrecognizing unit 57.

A mounting operation processing part 53 d controls the mounting headtransport mechanism 59 based on the alignment information calculated bythe alignment information calculating part 53 h so as to sequentiallyposition the chips 6 held by the respective nozzles 33 a with respect tothe corresponding electronic component mounting portions 9 a of theboard 9.

Next, the electronic component mounting operation in the standard modewill now be described in accordance with a flow chart of FIG. 11 withreference to FIG. 12 to FIG. 15. In this mounting operation, as shown inFIG. 5 and FIG. 6, such an operation example is represented in the casethat a mounting operation is continuously executed with respect to theboard 9 on which the chips 6 have already been mounted.

In FIG. 11, an electronic component sucking/holding operation is firstlycarried out (ST1). That is to say, the chips 6 are sucked/held from thestage 79 (refer to FIG. 7 and FIG. 8) by a plurality of nozzles 33 a ofthe mounting head 33 (component holding step). Then, while the mountinghead 33 which has held a chip 6 passes through an upper space of theprovisional positioning camera 15, a provisional recognizing operationof this chip 6 is carried out (ST2) As a result, the chip 6 under theholding condition by the mounting head 33 is photographed and then aposition of this photographed chip 6 is recognized. Then, based uponthis provisional recognizing result, a provisional positioning operationas to a first set is carried out (ST3). In other words, the mountinghead 33 is moved over the board 9 held by the holding unit 10, and then,the chip 6 which is sucked by one nozzle among the plural nozzles 33 aof the mounting head 33 is provisionally positioned over one electroniccomponent mounting portion 9 a corresponding to this one chip 6(provisional positioning step).

In this step, first of all, the chip 6 (namely, chip 6 held byright-sided nozzle 33 a in FIG. 12( a)) which is held by the mountinghead 33 is provisionally positioned to a first electronic componentmounting portion 9 a (namely, electronic component mounting portion 9 aadjacent to right side of previously mounted chip 6) of the board 9 inthis mounting operation. This provisional positioning operation iscarried out both the above-described provisional recognition result andthe array information of the electronic component mounting portion 9 astored in the board information storage part 53 e.

In parallel to these operations, a holding unit descending operation iscarried out in the holding unit 10 (ST4). As a result, a space where theobservation head is advanced may be secured over the holding unit 10.Then, under this condition, as shown in FIG. 12( a), the observationhead 34 is advanced to such a space defined between the board 9 and thechip 6 held by the mounting head 33, and then, an observation headpositioning operation is carried out (ST5).

Thereafter, an observation operation is carried out (ST6), so that bothan image of the provisionally positioned chip 6 and an image of theelectronic component mounting portion 9 a are acquired by theobservation head 34 which is located in the space defined between thischip 6 and the electronic component mounting portion 9 a (observationstep). In this step, first of all, as represented in FIG. 12( a), boththe image of the provisionally positioned chip 6 and the image of theelectronic component mounting portion 9 a are acquired by using theboard-imaging camera 36B and the electronic component-imaging camera 36Arespectively, while the above-described first set is recognized as arecognizing subject. In this example, the batch recognizing method (seeFIG. 6) is employed by which recognizing subjects are recognized via thewide visual field “W2” in the batch manner. Then, the position of themounting head 33 is stored into the provisional positioning positionalinformation storage part 53 f in relation to the set constituted by boththis chip 6 and the electronic component mounting portion 9 a as such aprovisional positioning positional information.

Thereafter, a relative positional information as to both this chip 6 andthe electronic component mounting portion 9 a is detected based upon theimage of the chip 6 and the image of the electronic component mountingportion 9 a, which have been acquired in the observation step (relativepositional relationship detecting step). In other words, based upon boththe images of the chip 6 and the electronic component mounting portion 9a, a position of this chip 6 and a position of the electronic componentmounting portion 9 a are recognized by the electronic componentrecognizing unit 54 and the board recognizing unit 55, and then, arelative positional relationship between the chip 6 and the electroniccomponent mounting portion 9 a is calculated by the relative positionalrelationship calculating process part 53 i. The calculation result isstored into the relative positional relationship storage part 53 g inrelation to the set of the chip 6 and the electronic component mountingportion 9 a corresponding thereto (storage step).

Next, a judgement is made as to whether or not there is another setconstituted by a next chip 6 and a next electronic component mountingportion 9 a (ST7). When there is the next set, both a provisionalpositioning operation (ST8) for the next set and an observation headpositioning operation (ST9) for the next set are executed. Contents ofthese operations are the same as those of the operations indicated in(ST3) and (ST5) respectively. In other words, as shown in FIG. 12( b),both the mounting head 33 and the observation head 34 are moved so as toposition the next chip 6 to the next electronic component mountingportion 9 a. At this time, the operation of the observation head 34 iscarried out in synchronism with the movement of the chip 6 by themounting head 33.

Then, thereafter, the process operation is returned to the step (ST6) inwhich an observing operation by the observation head 34 is carried out.Until such a confirmation is made that there is no next set in thesubsequent step (ST7), a provisional positioning step, an observingstep, and a relative positional relationship detecting step aresequentially carried out with respect to all of the chips which aresucked/held by other nozzles 33 a.

When the respective steps of the provisional positioning operation, theobserving operation, and the relative positional relationship detectingoperation have been accomplished as to all of these sets, an observationhead evacuating operation (ST10) is carried out, and subsequently, aholding unit ascending operation (interval changing step) is carried out(ST11). In other words, as shown in FIG. 13( a), the observation head 34is evacuated from the upper space of the board 9 (observation headevacuating step). Next, as indicated in FIG. 13( b), the holding unit 10is caused to ascend up to a component mounting height. Then, in parallelto these operations, the first set of the chip 6 is positioned withrespect to such an electronic component mounting portion 9 a (namely,both left-sided chip 6 held by mounting head 33 and second electroniccomponent mounting portion 9 a from previously mounted chip 6) (ST12).

When this positioning operation is carried out, first of all, thealignment information calculating part 53 h reads out both provisionalpositioning positional information and relative positional informationas to the relevant set from the provisional positioning positionalinformation storage part 53 f and the relative positional relationshipstorage part 53 g, and then, calculates alignment information requiredfor the positioning operation based upon both the read provisionalpositioning positional information and the read relative positionalrelationship (alignment information calculating step). Then, themounting operation processing part 53 d controls the mounting headtransport mechanism 59 based upon the calculated alignment informationso as to execute the positioning operation of the mounting head 33.

Then, thereafter, as indicated in FIG. 14( b), the nozzle 33 a which hasheld the first set of the above-explained chip 6 is caused to descend soas to mount the chip 6 on the electronic component mounting portion 9 aof the board 9 (ST13). Next, a check is made as to whether or not thereis a next set whose chip 6 will be mounted (ST14). As indicated in FIG.14( b), when there is the next set, a positioning operation is carriedout with respect to this next set (ST15). Then, the mounting operationis returned to the previous step (ST13). In this step (ST13), as shownin FIG. 15( a) and FIG. 15( b), the nozzle 33 a is caused to descend soas to mount the chip 6 on the board 9.

In other words, while the relative positional relationship detected inthe relative positional relationship detecting step is reflected to thetransport of the mounting head 33, since the mounting head 33 is moved,the mounting operation in which the chips 6 sucked/held by the pluralnozzles 33 are positioned with respect to the electronic componentmounting portions 9 a so as to be mounted on the board 9 is carried outas to all of the chips sucked/held by the nozzles 33 a of the mountinghead 33. Then, in a step (ST14), a confirmation is made that there is nonext set and also the chip mounting operations have been accomplished asto all of the chips 6, and then, the electronic component mountingoperation is ended.

As previously explained, the electronic component mounting method in thestandard mode is realized by sequentially executing the below-mentionedmounting operations. That is, when the chips 6 are mounted on the board9 by using the mounting head 33 equipped with a plurality of nozzles 33a, the observing operations are previously carried out by defining allsets of the chips 6 and the electronic component mounting portions 9 aas the observation subjects. After the information (namely, provisionalpositioning positional information and relative positional relationship)has been prepared for all of these sets, which is required so as tocalculate the alignment information as to the positioning operation whenthe mounting operation is carried out, the alignment information iscalculated with respect to each of these chips to be mounted in order toexecute the positioning operation, and then, the nozzle 33 a is causedto descend so as to land the chip 6 on the electronic component mountingportion 9 a.

As a consequence, every time the mounting operation with respect to onechip 6 is carried out, the observation head 34 is no longer advanced andevacuated between the mounting head 33 and the holding unit 10, so thatthe operation time can be shortened. Then, when the chip 6 is landed onthe board 9, since the nozzle 33 a is caused to descend under such acondition that the holding unit 10 has been caused to ascend up to thecomponent mounting height, the time required for causing the nozzle 33 ato descend in the mounting operation can be shortened, so that theentire operation time can be furthermore shortened. That is, in theabove-explained electronic component mounting method corresponds to sucha general-purpose mounting operation execution mode as the standard modecapable of mounting the electronic components on the board in a highefficiency.

Referring now to FIG. 16 to FIG. 22, a description is made of aprocessing function and an electronic component mounting operation ofthe electronic component mounting apparatus in the high precision mode.The electronic component mounting operation in the high precision modecontains: a step in which chips (electronic components) 6 aresucked/held by a plurality of nozzles (mounting nozzles) 33 a of themounting head 33; a provisional positioning step in which one chip 6sucked/held by one nozzle among the plural nozzles 33 a of the mountinghead 33 is provisionally positioned above one of the electroniccomponent mounting portions 9 a; an observing step in which both animage of this provisionally positioned chip 6 and an image of theelectronic component mounting portion 9 a are acquired by theobservation head 34 which is located in a space defined between thisprovisionally positioned chip 6 and the electronic component mountingportion 9 a; a relative positional relationship detecting step in whicha relative positional relationship between the chip 6 and the electroniccomponent mounting portion 9 a is detected based upon the image of thechip 6 and the image of the electronic component mounting portion 9 a,which have been acquired in the observing step; an observation headevacuating step in which the observation head 34 is evacuated from theupper space of the board 9; an electronic component mounting step inwhich such a chip 6 which has been provisionally positioned by movingthe mounting head 33 while reflecting the relative positionalrelationship detected in the above-described relative positionalrelationship detecting step is positioned with respect to the electroniccomponent mounting portion 9 a; a provisional positioning step in whichall of the chips sucked/held by other nozzles 33 a are provisionallypositioned; and a step for sequentially executing the observing step,the relative positional relationship detecting step, the observationhead evacuating step, and the electronic component mounting step.

A functional block diagram of the high precision mode shown in FIG. 16is arranged by eliminating both the provisional positioning positionalinformation storage part 53 f and the relative positional relationshipstorage part 53 g from the functional block diagram of the standard modeindicated in FIG. 10, namely, is formed by deleting such a function forstoring both provisional positioning positional information and relativepositional relationship information, which constitute a base capable ofcalculating alignment information. In this high precision mode, whiletwo sets of the above-explained information are not once stored,alignment information is calculated. That is, as shown in FIG. 16, analignment information calculating part 53 h calculates such an alignmentinformation based upon a relative positional relationship between a chip6 and an electronic component mounting portion 9 a, which is calculatedby a relative positional information calculating process part 53 i, anda present position (provisional positioning positional information) ofthe mounting head 33 transferred from a mounting head transportmechanism 59.

Next, the electronic component mounting operation in the high precisionmode will now be described in accordance with a flow chart of FIG. 17with reference to FIG. 18 to FIG. 22. In this mounting operation,similar to the above-described mounting operation, such an operationexample is represented in the case that a mounting operation iscontinuously executed with respect to the board 9 on which the chips 6have already been mounted.

In FIG. 17, since respective steps shown in (ST21) to (ST25) own thesame contents as those of the steps (ST1) to (ST5) shown in FIG. 11,explanations thereof are omitted. Since these respective steps arecompleted, both the chips 6 and the electronic component mountingportions 9 a are brought into observable conditions.

Thereafter, an observing operation is carried out (ST26), so that bothan image of the provisionally positioned chip 6 and an image of theelectronic component mounting portion 9 a are acquired by theobservation head 34 which is located in the space defined between thischip 6 and the electronic component mounting portion 9 a. Similar to theembodiment 1, in this step, first of all, as represented in FIG. 18( a),both the image of the provisionally positioned chip 6 and the image ofthe electronic component mounting portion 9 a are acquired by using theobservation head 34.

Thereafter, a relative positional relationship as to both this chip 6and the electronic component mounting portion 9 a is detected based uponthe image of the chip 6 and the image of the electronic componentmounting portion 9 a, which have been acquired in the observing step. Inother words, based upon both the images of the chip 6 and the electroniccomponent mounting portion 9 a, a position of this chip 6 and a positionof the electronic component mounting portion 9 a are recognized by theelectronic component recognizing unit 54 and the board recognizing unit55, and then, a relative positional relationship between the chip 6 andthe electronic component mounting portion 9 a is calculated by therelative positional relationship calculating process part 53 i. Then,the alignment information calculating part 53 h calculates alignmentinformation based upon the calculated relative positional relationshipand the present position of the mounting head 33, which is transferredfrom the mounting head transport mechanism 59.

When the relative positional relationship has been detected as to oneset, after the evacuating operation of the observation head 34 iscarried out (ST27), ascending operation of the holding unit 10 issubsequently carried out (ST28). In other words, as shown in FIG. 18(b), the observation head 34 is evacuated from the upper space of theboard 9. Next, as shown in FIG. 19( a), the holding unit 10 is caused toascend up to a component mounting height. Then, in parallel to theseoperations, the first set of the chip 6 is positioned with respect tosuch an electronic component mounting portion 9 a (namely, bothright-sided chip 6 held by mounting head 33 and electronic componentmounting portion 9 a located adjacent to previously-mounted chip 6(ST29).

Then, thereafter, as indicated in FIG. 19( b), the nozzle 33 a which hasheld the first set of the above-explained chip 6 is caused to descend soas to mount the chip 6 on the electronic component mounting portion 9 aof the board 9 (ST30). Next, a check is made as to whether or not thereis a next set whose chip 6 will be mounted (ST31). In this case, in sucha case that there is the next set, the mounting operation is returned tothe operation for performing the observing operation by the observationhead 34. That is to say, as shown in FIG. 20( a), the holding unit 10 iscaused to descend up to a recognition height (ST32), and the observationhead 34 is advanced to a space defined between the chip 6 and the board9 so as to execute the positioning operation of the observation head 34(ST33).

In parallel to these steps, a provisional positioning operation as tothe next set is carried out (ST34). Then, the mounting operation isreturned to the step (ST26), and as indicated in FIG. 20( b), both animage of the chip 6 and an image of the electronic component mountingportion 9 a are acquired by the observation head 34. Then, similarly, arelative positional relationship is detected. Thereafter, as shown inFIG. 21( a), the observation head 34 is evacuated from the upper spaceof the holding unit 10. Next, as shown in FIG. 21( b), the holding unit10 is caused to ascend up to the component mounting height, and then,the chip 6 of the next set is positioned to the electronic componentmounting portion 9 a (namely, left-sided chip 6 held by mounting head33, and electronic component mounting portion 9 a located adjacent tochip 6 which has been mounted in preceding mounting operation).

Thereafter, as shown in FIG. 22( a), the nozzle 33 a is caused todescend so as to mount the chip 6 on the electronic component mountingportion 9 a of the board 9 (ST30). Then, these steps are repeatedlycarried out. If such a judgement is made that there is no next set whosechip 6 will be mounted in the step (ST31), then the electronic componentmounting operation is accomplished.

As previously explained, in accordance with the electronic componentmounting method in the high precision mode, while the chips 6 aremounted on the board 9 by the mounting head 33 equipped with a pluralityof nozzles 33 a, one set of the chip 6 and the electronic componentmounting portion 9 a are observed as the observation set. If thealignment information used to position these chip 6 and electroniccomponent mounting portion 9 a is obtained based upon the observationresult, then the electronic component mounting operation by the mountinghead 33 may be immediately carried out based upon this alignmentinformation.

As a result, when the mounting head 33 is positioned based upon thealignment information, such a positioning error can be eliminated whichis caused by the mechanism errors of the respective shafts employed inthe mounting head transport mechanism 59 which transports the mountinghead 33, so that high mounting position precision may be realized. Thatis, the above-described mounting method implies such a mountingoperation execution mode in the high precision mode, which owns such apurpose that the high-precision component which requires the highpackaging precision may be mounted on the board in better positionalprecision.

FIG. 23 is a functional block diagram for representing process functionsin such a case of a high speed mode of the electronic component mountingapparatus according to the embodiment 1 of the present invention. FIG.24 is a flowchart for explaining an electronic component mounting method(high speed mode) of the embodiment 1 of the present invention.

The functional block diagram shown in FIG. 23 is arranged by eliminatingthe provisional positioning positional information storage part 53 f,the relative positional relationship storage part 53 g, the relativepositional relationship calculating process part 53 i, the provisionalpositioning operation processing part 53 c, the electroniccomponent-imaging camera 36A, and also, the electronic componentrecognizing unit 54 from the functional block diagram of the standardmode shown in FIG. 10. This functional block diagram of FIG. 23 isformed by that a method of calculating alignment information issimplified.

As shown in FIG. 23, an alignment information calculating part 53 hcalculates alignment information based upon both a position recognitionresult of a chip 6 and a position recognition result of a board 9. Thisposition recognition result of the chip 6 is obtained by that an imageof this chip 6 acquired by the provisional positioning camera 15 isrecognized by the electronic component provisional recognizing unit 57.The position recognition result of the board 9 is obtained by that animage of this board 9 acquired by the board-imaging camera 36B isrecognized by the board recognizing unit 55. The position recognizingoperation of the board 9 is carried out based upon a position of afeature portion such as a recognition mark formed on the board 9.

In other words, positions of the respective electronic componentmounting portions 9 a are specified based upon array information of theelectronic component mounting portion 9 a contained in the boardinformation which has been stored in the board information storage part53 e, and also, a positional shift of the board 9 obtained by the boardrecognizing operation. Then, a final target position of the mountinghead 33 is calculated based upon both the position of this electroniccomponent mounting portion 9 a and a positional shift amount of the chip6 obtained from the recognition result of the chip 6.

Next, electronic component mounting operation in the high speed modewill now be described with reference to a flow chart of FIG. 24. Thiselectronic component mounting operation corresponds to such a high speedmode of mounting operation which is executed by employing thiselectronic component mounting apparatus. Prior to a commencement of themounting operation, the board 9 held by the holding unit 10 isrecognized by the board-imaging camera 36B, and thus, a positional shiftof the board 9 is detected. Then, in FIG. 24, an electronic componentsucking/holding operation is firstly carried out (ST41).

That is to say, the chips 6 are sucked/held from the stage 79 by aplurality of nozzles 33 a of the mounting head 33. Then, while themounting head 33 which has held a chip 6 passes through an upper spaceof the provisional positioning camera 15, a provisional recognizingoperation of this chip 6 is carried out (ST42) As a result, the chip 6under the holding condition by the mounting head 33 is photographed andthen a position of this photographed chip 6 is recognized. Then, basedupon this provisional recognizing result, a provisional positioningoperation as to a first set is carried out (ST43).

Thereafter, the present provisional positioning operation is advanced toamounting operation. In this case, the nozzle 33 a which holds the firstchip 6 set under the provisional positioning condition is caused todescend so as to mount the chip 6 on the electronic component mountingportion 9 a of the board 9. Next, a check is made as to whether or notthere is a next set whose chip 6 will be mounted. When there is the nextset, a provisional positioning operation is carried out with respect tothe next set (ST46). Then, the mounting operation is returned to theprevious step (ST44). In this step, such a mounting operation issimilarly carried out in which the nozzle 33 a is caused to descend.Then, these steps are repeatedly carried out. When it is so judged atthe step (ST45) that no set is present whose chip 6 will be mounted, theelectronic component mounting operation is accomplished.

As previously explained, the electronic component mounting method in thehigh speed mode is realized by sequentially executing thebelow-mentioned mounting operations. That is, when the chips 6 aremounted on the board 9 by using the mounting head 33 equipped with aplurality of nozzles 33 a, the alignment information is calculated basedupon both the position of the chip 6 which is detected by acquiring theimage of this chip 6 by the provisional positioning camera 15 and theposition of the electronic component mounting portion 9 a. The positionof the chip 6 is detected by the provisional positioning camera 15 inthe path through which the mounting head 33 holding the chip 6 istransported from the component supply unit 2 to the holding unit 10. Theposition of the electronic component mounting portion 9 a is detected byconsidering the board recognition result with respect to the previouslystored array information of the electronic component mounting portion 9a.

As a result, the electronic component mounting operation can be carriedout while the observing operation required for the positioning operationis not carried out every set of the chip 6 and the electronic componentmounting portion 9 a. In other words, the above-described electroniccomponent mounting method corresponds to such a high-speed mounting modethat such an electronic component to which high mounting positionalprecision is not required can be mounted in the high speed within ashort tack time.

As previously explained, the electronic component mounting apparatusshown in the embodiment 1 is capable of selecting the high precisionmode and the high speed mode in response to the mounting precision whichis required for the electronic component to be mounted except for themounting execution mode of the general-purpose standard mode by whichthe superior mounting positional precision is compatible with thehigh-efficiency component mounting work.

In other words, the mounting execution mode of the high precision modedesigned for the high precision component which requires the highpackaging precision, and furthermore, the high-speed mounting mode inwhich the electronic component which does not require the high mountingpositional precision can be mounted in the high speed within a shorttact time.

(Embodiment 2)

Next, a description is made of an electronic component mountingapparatus according to an embodiment 2 of the present invention. As tothe electronic component mounting apparatus of the embodiment 2, only aprocessing mechanism operated in a standard mode is different from thatof the embodiment 1, and other arrangements and processing functions inboth a high precision mode and a high speed mode are identical to thoseof the embodiment 1. Accordingly, the explanation as to the electroniccomponent mounting apparatus according to the embodiment mode 2 islimited to a processing function executed in the standard mode.

FIG. 25 is a functional block diagram for indicating the processingfunction in the case that the electronic component mounting apparatusaccording to the embodiment 2 of the present invention is operated inthe standard mode. In the embodiment 1 (see FIG. 10), both theprovisional positioning positional information of the mounting head 33and the information indicative of the relative positional relationshipbetween the chip 6 and the electronic component mounting portion 9 a arestored every set of the chip 6 and the electronic component unit 9 a. Inthe embodiment 2, alignment information is stored every set of the chip6 and the electronic component unit 9 a.

In other words, as shown in FIG. 25, relative positional relationshipcalculated by the relative positional relationship calculating processpart 53 i is not once stored, but is directly transferred to thealignment information calculating part 53 h. The alignment informationcalculating part 53 h calculates alignment information based upon both aposition of the mounting head when a provisional positioning operationis performed, which has been stored in the provisional positioningpositional information storage part 53 f, and the relative positionalrelationship calculated by the relative positional relationshipcalculating process part 53 i (alignment information calculating step).

The alignment information storage part 53 j stores thereinto thealignment information calculated by the alignment informationcalculating part 53 h every set of the chip 6 and the electroniccomponent mounting portion 9 a (storage step). When a mounting operationis controlled by the mounting operation processing part 53 d, themounting head transport mechanism 59 is controlled based upon thealignment information stored in the alignment information storage part53 j. Similar to the embodiment 1, also in this embodiment 2, since themounting operation is carried out after the observing operations used tocalculate the alignment information have been previously carried out asto all of the sets, a similar effect may be achieved.

As previously described, in the electronic component mounting method(standard mode) according to the embodiment 2 of the present invention,in such an electronic component mounting operation that the chips 6 aresucked/held by the respective plurality nozzles 33 a provided on themounting head 33 and are mounted on the electronic component mountingportions 9 a of the board 9, such a relative position detectingoperation is carried out with respect to all of the chips 6 which havebeen sucked/held by the nozzles 33 a. In this relative positiondetecting operation, both the provisionally positioned chip 6 and theelectronic component mounting portion 9 a are observed by theobservation head 34 which is located in the space defined between thischip 6 and the electronic component mounting portion 9 a. Then, themounting operation for positioning the chip 6 with respect to theelectronic component mounting portion 9 a by reflecting the calculatedrelative positional relationship so as to mount this positioned chip 6thereon is sequentially carried out with respect to all of the chips 6.

As a result, the tact time per one electronic component can be largelyshortened, as compared with the conventional method in which theobservation camera is advanced/evacuated between the mounting head andthe board every time one electronic component is mounted. Furthermore,while the holding unit for holding the board is arranged in such a waythat this holding unit can be elevated, since the interval between theboard and the mounting head is made narrow when the mounting operationis carried out, the time required for elevating the nozzles can beshortened, so that the tact time can be furthermore shortened, and also,the superior mounting position precision can be compatible with thehigh-efficiency component mounting work.

In accordance with the present invention, in such an electroniccomponent mounting operation that the electronic components aresucked/held by the respective plurality nozzles provided on the mountinghead and are mounted on the electronic component mounting portions ofthe board 9, such a relative position detecting operation is carried outwith respect to all of the electronic components which have beensucked/held by the nozzles, while in this relative position detectingoperation, both the provisionally positioned electronic component andthe electronic component mounting portion are observed by theobservation head which is located in the space defined between thiselectronic component and the electronic component mounting portion.Then, the mounting operation for positioning the electronic componentwith respect to the electronic component mounting portion by reflectingthe calculated relative positional relationship so as to mount thispositioned electronic component thereon is sequentially carried out withrespect to all of the electronic components. As a consequence, thebetter mounting positional precision can be compatible with thehigh-efficiency component mounting work.

1. An electronic component mounting method in which an electroniccomponent is sucked and held by each of a plurality of mounting nozzlesprovided in a mounting head so as to be mounted on an electroniccomponent mounting portion of a board, comprising: a component holdingstep for sucking and holding electronic components by said plurality ofmounting nozzles of said mounting head; a provisional positioning stepfor provisionally positioning the electronic component sucked and heldby one of said plural mounting nozzles above one electronic componentmounting portion; an observing step in which both an image of theprovisionally positioned electronic component and an image of theelectronic component mounting portion are acquired by an observationhead located in a space defined between said provisionally positionedelectronic component and the electronic component mounting portion; arelative positional relationship detecting step for detecting a relativepositional relationship between said provisionally positioned electroniccomponent and said electronic component mounting portion based upon saidimages of both said electronic component and said electronic componentmounting portion, which are acquired in said observing step; a step forsequentially executing said provisional positioning step, said observingstep, and said relative positional relationship detecting step as to allof the electronic components sucked and held by other mounting nozzles;an observation head evacuating step for evacuating said observation headfrom an upper space of the board; and a step in which such a mountingoperation that the electronic components sucked and held by saidplurality of mounting nozzles are positioned so as to be mounted on theelectronic component mounting portions by transporting said mountinghead while reflecting thereto the relative positional relationshipdetected in said relative positional relationship detecting step iscarried out with respect to all of the electronic components.
 2. Anelectronic component mounting method as claimed in claim 1, whereinafter said observation head evacuating step, an interval changing stepfor narrowing an interval between said board and said mounting nozzlesis executed; and thereafter, said mounting operation is carried outwhile said mounting nozzles are elevated.
 3. An electronic componentmounting method as claimed in claim 2, wherein said interval changingstep causes the board to ascend with respect to said mounting head. 4.An electronic component mounting method as claimed in claim 1, whereinthe electronic component corresponds to such an electronic component inwhich a plurality of bumps have been formed on a surface thereof; andsaid bumps are mounted on electrodes of the electronic componentmounting portions of said board.
 5. An electronic component mountingmethod as claimed in claim 4, further comprising: a step for reversingthe electronic component supplied in such a manner that the plane ofsaid electronic component where the bumps have been formed is directedto an upper direction, and for supplying the reversed electroniccomponent to said mounting head.
 6. An electronic component mountingmethod as claimed in claim 4, further comprising: an electroniccomponent transporting step for transporting the electronic componentsupplied in such a manner that the plane of said electronic componentwhere the bumps have been formed is directed to the upper direction toup-down reversing means by an electronic component transport mechanism;an up-down reversing step for turning the electronic component upsidedown by the up-down reversing means; and a step for picking up theup-down reversed electronic component by said mounting head.
 7. Anelectronic component mounting method as claimed in claim 4, furthercomprising: an electronic component transporting step for transportingthe electronic component supplied in such a manner that the plane ofsaid electronic component where the bumps have been formed is directedto the upper direction to up-down reversing means by said mounting head;an up-down reversing step for turning the electronic component upsidedown by the up-down reversing means; and a step for picking up theup-down reversed electronic component by said mounting head.
 8. Anelectronic component mounting method in which an electronic component issucked/held by each of a plurality of mounting nozzles provided in amounting head so as to be mounted on an electronic component mountingportion of aboard, comprising: a component holding step for sucking andholding electronic components by said plurality of mounting nozzles ofsaid mounting head; a provisional positioning step for provisionallypositioning the electronic component sucked and held by one of saidplural mounting nozzles above one electronic component mounting portion;an observing step in which one set of both an image of the provisionallypositioned electronic component and an image of the electronic componentmounting portion are acquired by an observation head located in a spacedefined between said provisionally positioned electronic component andthe electronic component mounting portion; a relative positionalrelationship detecting step for detecting a relative positionalrelationship between said provisionally positioned electronic componentand said electronic component mounting portion based upon said images ofboth said electronic component and said electronic component mountingportion, which are acquired in said observing step; a storage step forstoring thereinto said relative positional relationship and provisionalpositioning positional information corresponding to positionalinformation of said provisionally positioned mounting head; a step inwhich since said provisional positioning step, said observing step, saidrelative positional relationship detecting step, and said storage stepare sequentially executed every a set of both all of said electroniccomponents sucked and held by other mounting nozzles and the electroniccomponent mounting portions on which said electronic components aremounted, both the provisional positioning positional information and therelative positional relationship are stored every said set; anobservation head evacuating step for evacuating said observation headfrom an upper space of the board; and a step in which alignmentinformation is calculated every said set based upon said storedprovisional positioning positional information and said stored relativepositional information, and then, such a mounting operation is executedevery said set, in which the electronic components are positioned so asto be mounted with respect to the electronic component mounting portionsby transporting said mounting head based upon said alignmentinformation.
 9. An electronic component mounting method as claimed inclaim 8, wherein after said observation head evacuating step, aninterval changing step for narrowing an interval between said board andsaid mounting nozzles is executed; and thereafter, said mountingoperation is carried out while said mounting nozzles are elevated. 10.An electronic component mounting method as claimed in claim 9, whereinsaid interval changing step causes the board to ascend with respect tosaid mounting head.
 11. An electronic component mounting method asclaimed in claim 8, wherein the electronic component corresponds to suchan electronic component in which a plurality of bumps have been formedon a surface thereof; and said bumps are mounted on electrodes of theelectronic component mounting portions of said board.
 12. An electroniccomponent mounting method as claimed in claim 11, further comprising: astep for reversing the electronic component supplied in such a mannerthat the plane of said electronic component where the bumps have beenformed is directed to an upper direction, and for supplying the reversedelectronic component to said mounting head.
 13. An electronic componentmounting method as claimed in claim 11, further comprising: anelectronic component transporting step for transporting the electroniccomponent supplied in such a manner that the plane of said electroniccomponent where the bumps have been formed is directed to the upperdirection to up-down reversing means by an electronic componenttransport mechanism; an up-down reversing step for turning theelectronic component upside down by the up-down reversing means; and astep for picking up the up-down reversed electronic component by saidmounting head.
 14. An electronic component mounting method as claimed inclaim 11, further comprising: an electronic component transporting stepfor transporting the electronic component supplied in such a manner thatthe plane of said electronic component where the bumps have been formedis directed to the upper direction to up-down reversing means by saidmounting head; an up-down reversing step for turning the electroniccomponent upside down by the up-down reversing means; and a step forpicking up the up-down reversed electronic component by said mountinghead.
 15. An electronic component mounting method in which an electroniccomponent is sucked and held by each of a plurality of mounting nozzlesprovided in a mounting head so as to be mounted on an electroniccomponent mounting portion of a board, comprising: a component holdingstep for sucking and holding electronic components by said plurality ofmounting nozzles of said mounting head; a provisional positioning stepfor provisionally positioning the electronic component sucked and heldby one of said plural mounting nozzles above one electronic componentmounting portion; an observing step in which one set of both an image ofthe provisionally positioned electronic component and an image of theelectronic component mounting portion are acquired by an observationhead located in a space defined between said provisionally positionedelectronic component and the electronic component mounting portion; arelative positional relationship detecting step for detecting a relativepositional relationship between said provisionally positioned electroniccomponent and said electronic component mounting portion based upon saidimages of both said electronic component and said electronic componentmounting portion, which are acquired in said observing step; analignment information calculating step for calculating alignmentinformation based upon both said relative positional relationship andprovisional positioning positional information corresponding topositional information of said provisionally positioned mounting head; astorage step for storing thereinto said calculated alignmentinformation; a step in which since said provisional positioning step,said observing step, said relative positional relationship detectingstep, said alignment information calculating step, and said storage stepare sequentially executed every a set of both all of said electroniccomponents sucked and held by other mounting nozzles and the electroniccomponent mounting portions on which said electronic components aremounted, alignment information is stored every said set; an observationhead evacuating step for evacuating said observation head from an upperspace of the board; and a step in which such a mounting operation isexecuted every said set, in which the electronic components arepositioned so as to be mounted with respect to the electronic componentmounting portions by transporting said mounting head based upon saidstored alignment information.
 16. An electronic component mountingmethod as claimed in claim 15, wherein after said observation headevacuating step, an interval changing step for narrowing an intervalbetween said board and said mounting nozzles is executed; andthereafter, said mounting operation is carried out while said mountingnozzles are elevated.
 17. An electronic component mounting method asclaimed in claim 16, wherein said interval changing step causes theboard to ascend with respect to said mounting head.
 18. An electroniccomponent mounting method as claimed in claim 15, wherein the electroniccomponent corresponds to such an electronic component in which aplurality of bumps have been formed on a surface thereof; and said bumpsare mounted on electrodes of the electronic component mounting portionsof said board.
 19. An electronic component mounting method as claimed inclaim 18, further comprising: a step for reversing the electroniccomponent supplied in such a manner that the plane of said electroniccomponent where the bumps have been formed is directed to an upperdirection, and for supplying the reversed electronic component to saidmounting head.
 20. An electronic component mounting method as claimed inclaim 18, further comprising: an electronic component transporting stepfor transporting the electronic component supplied in such a manner thatthe plane of said electronic component where the bumps have been formedis directed to the upper direction to up-down reversing means by anelectronic component transport mechanism; an up-down reversing step forturning the electronic component upside down by the up-down reversingmeans; and a step for picking up the up-down reversed electroniccomponent by said mounting head.
 21. An electronic component mountingmethod as claimed in claim 18, further comprising: an electroniccomponent transporting step for transporting the electronic componentsupplied in such a manner that the plane of said electronic componentwhere the bumps have been formed is directed to the upper direction toup-down reversing means by said mounting head; an up-down reversing stepfor turning the electronic component upside down by the up-downreversing means; and a step for picking up the up-down reversedelectronic component by said mounting head.